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1/14 www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. power management ics for automotive body control regulator with voltage detector and watchdog timer BD3021HFP-M description BD3021HFP-M is a regulator ic with integrated wdt (watch dog timer), high output voltage accuracy 2.0% and 80a (typ.) low circuit current consumption. BD3021HFP-M supports usage of low esr ceramic capacitor for output stability. BD3021HFP-M can be a stable power supply for any applicat ions while detecting malfunction of microcontrollers. features 1) wdt can be switched on/off by using inh pin 2) low circuit current: 80a(typ.) 3) output circuit: pch dmos 4) high output voltage accuracy: 5v 2% 5) supports low esr ceramic capacitor 6) vcc max voltage: 50v 7) integrated over current pr otection and thermal shut down 8) hrp7 packaging applications any application using a microcontroller or a dsp such as aut omotive (body control), displa y, server, dvd, phone, etc? absolute maximum ratings (ta=25 ) parameter symbol ratings unit supply voltage *1 vcc -0.3 ~ +50 v inh pin voltage vinh -0.3 ~ +15 v regulator output pin voltage vout -0.3 ~ +15 v reset output pin volta ge vreset -0.3 ~ +15 v watchdog input pin voltage vclk -0.3 ~ +15 v reset delay setting pin voltage vct -0.3 ~ +15 v power dissipation *2 pd 1.6 w operating temperature ra nge topr -40 ~ +125 storage temperature range tstg -55 ~ +150 maximum junction temperature tjmax 150 *1 not to exceed pd. *2 reduced by 12.8w / c over ta = 25c, when mounted on glass epoxy board: 70mm 70mm 1.6mm. operating conditions (ta=-40~125c) parameter symbol min max unit supply voltage *3 vcc 5.6 36.0 v output current io 0 500 ma *3 for the output voltage, consider the voltage drop (dropout voltage) due to the output current. note: this product is not designed for protection against radioactive rays. no.10039eat10
technical note 2/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. electrical characteristics (unless otherwise specified, ta =25c, vcc=13.5v, clk=gnd) parameter symbol min. typ. max. unit conditions overall device bias current 1 icc1 80 130 a io=0ma bias current 2 icc2 150 300 a io=50ma(ta=25 ) regulator output voltage vout 4.90 5.00 5.10 v io=200ma line regulation line.reg 5 35 mv vcc=5.6 ~ 36v load regulation load.reg 30 70 mv io=5 ~ 200ma dropout voltage vd 0.3 0.6 v vcc=4.75v, io=200ma ripple rejection r.r. 45 55 db f=120hz, ein=1vrms, io=100ma reset detection voltage vdet 4.40 4.50 4.60 v hysteresis width vhs 50 100 150 mv output delay time low ? high (power on reset time) tdlh 1.1 1.9 2.7 ms vcc=vdet 0.5v(vcc=vout) inh=open,ct=0.01f output delay time high low tdhl 100 300 s vcc=vdet 0.5v(vcc=vout) inh= open,ct=0.01f reset discharge urrent ireset 0.2 ma vcc=1.5v,reset=0.5v (vcc=vout) ct discharge current ict 0.1 ma vcc=1.5v,ct=0.5v (vcc=vout) low output voltage vrst 0.1 0.2 v vout=4.0v min. operating voltage vopl 1.5 v watchdog timer ct switching threshold voltage high vthh 1.08 1.15 1.25 v wdt on, inh= open ct switching threshold voltage low vthl 0.13 0.15 0.17 v wdt on, inh= open wdt charge current ictc 3.5 6.0 8. 5 a wdt on, inh= open, ct=0v wdt discharge current ictd 1.2 2.0 2.8 a wdt on, inh= open, ct=1.3v watchdog monitor time low twh 3.0 5.0 7.0 ms wdt on, inh= open, ct=0.01f(ceramic cap) characteristics of ceramic cap not considered. watchdog reset time twl 1.0 1.7 2.4 ms clk input pulse width twclk 500 ns inh wdt off threshold voltage vhinh vout 0.8 vout v wdt on threshold voltage vlinh 0 vout 0.3 v inh input current iinh 10 20 a inh=5v
technical note 3/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. electrical characteristics (unless otherwise specified, ta=25c, vcc=13.5v, clk=gnd ) 0 1 2 3 4 5 6 0 5 10 15 20 25 supply voltage : vcc [v] output voltage: vout [v] ta =25 ta =12 5 ta =-4 0 4.50 4.75 5.00 5.25 5.50 -40 0 40 80 120 ambient temperature: ta [ ] output voltage: vout [v] 0 100 200 300 400 500 0 100 200 300 400 500 output current: iout [ma] circuit current : icc2 [a] 0 20 40 60 80 100 120 0 5 10 15 20 25 supply voltage: vcc [v] circuit current: icc1 [a] ta =25 ta =-4 0 ta =12 5 0 20 40 60 80 10 100 1000 10000 100000 1000000 frequency : f [hz] ripple rejection: r.r. [db] ta =-4 0 ta =12 5 ta =25 0 0.2 0.4 0.6 0.8 1 0 100 200 300 400 500 output current: io [ma] dropout voltage: ? vd [v] ta =-4 0 ta =12 5 ta =25 0 1 2 3 4 5 6 100 120 140 160 180 200 ambient temperature: ta [ ] output voltage: vout [v] -3 -1 1 3 5 7 9 00.511.522.53 ct pin voltage: vct [v] ct pin current: ictc,cto [a] ta =-4 0 ta =12 5 ta =25 0 1 2 3 4 5 6 0.00.20.40.60.81.01.2 output current: io[a] output voltage: vo[v] ta =25 ta =12 5 ta =-4 0 0 1 2 3 4 5 6 -40 0 40 80 120 ambient temperature: ta [] wdt : twl,h [ms ] reset time watch time reset voltage: vreset [v] output voltage: vout [v] 0 1 2 3 4 5 0 2 4 6 8 10 fig.3 input stability fig.2 circuit current fig.1 circuit current fig. 4 load stability fig.5 dropout voltage fig. 6 ripple rejection fig. 7 output voltage temperature characteristics fig.8 thermal shutdown circuit characteristics fig.9 restion voltage (vcc=vout) detection voltage: vdet[v] ambient temperature: ta [ ] -40 0 40 80 120 4.2 3.8 4.0 4.4 4.6 4.8 vdet vhs fig.10 ct pin charge / discharge current (vcc=5v) fig.11 reset detection voltage vs. temperature fig.12 wdt time vs. temperature (ct=0.01f)
technical note 4/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. measurement circuit for reference data measurement circuit of fig.1 clk vcc gnd vout reset ct clk vcc gnd vout reset ct v measurement circuit of fig.4 clk vcc gnd vout reset ct v measurement circuit of fig.5 clk vcc gnd vout reset ct io v measurement circuit of fig.6 clk vcc gnd vout reset ct v 100ma ~ measurement circuit of fig.9 and fig11 clk vcc gnd vout reset ct v measurement circuit of fig.12 measurement circuit of fig.10 clk vcc gnd vout reset ct clk vcc gnd vout reset ct a v clk vcc gnd vout reset ct io a inh measurement circuit of fig.2 measurement circuit of fig.3 and fig.7 and fig.8 oscilloscope inh inh inh inh inh inh inh inh a a
technical note 5/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. block diagrams fig.13 pin no. pin name function 1 clk clock input from microcontroller 2 inh wdt on/off function pin 3 vcc power supply pin 4 gnd gnd 5 vout voltage output pin 6 reset reset output pin 7 ct external capacitance for re set output delay time, wdt monitor time setting connection pin fin gnd gnd top view (package dimension) (unit : mm) hrp7 s 0.08 0.730.1 1.27 0.8875 1.9050.1 0.8350.2 1.5230.15 10.540.13 0.080.05 (max 9.745 include burr) 9.3950.125 s 1.0170.2 8.00.13 0.27 +0.1 - 0.05 4.5 + 5.5 ? 4.5 8.820.1 (6.5) 765432 1 (7.49) clk edge wdt vthh vthl inh vcc gnd vout reset ct tsd vref prereg vcc vcc vref_r ocp vref_r on/off circuit
technical note 6/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. input / output equivalent circuit diagrams (resistance value is typical value) clk(1pin) inh(2pin) vcc(3pin) vout(5pin) reset(6pin) ct(7pin) vcc ic vout ct vout clk 10k vcc 3.7m 1.25m vout 470k reset vout 1k 500k vout inh 10k
technical note 7/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. BD3021HFP-M (power on reset / watchdog timer) power on reset (output delay time) is adjustable by ct pin capacitor. tdlh(s) P(1.15v ct capacitance(f) / ictc(a) (typ.) ? tdlh :output delay time( power on reset) ? 1.15v :upper switching threshold voltage(typ.) ? ct capacitance :capacitor connected to ct pin ?ictc :wdt charge current calculation example) with 0.01f ct pin capacitor tdlh(s)=1.15v 0.01f/6a P 1.9msec if the ct capacitance is not the same as the condition on the electrical characteristics table, i.e., 0.01f, choose the capaci tance value in ratio referring to the above equation. watch dog timer ( wdt watch time, reset time) is adjustable by the ct pin capacitor twh(s) P(1.00v ct capacitance (f))/ ictd(a) (typ.) twl(s) P(1.00v ct capacitance (f))/ ictc(a) (typ.) ?twh :wdt watch time (delay time to turn the reset on) ?twl :wdt reset time (time the reset is on) ? 1.00v :upper switching threshold voltage lower switching threshold voltage ? ct capacitance :ct pin capacitor shared with power on reset ?ictc :wdt charge current ? ictd :wdt discharge current calculation example) with 0.01f ct pin capacitor twh(s)P1.00v 0.01f/2a P 5.0msec (typ.) twl(s) P1.00v 0.01f/6a P 1.7msec (typ.) if the ct capacitance is not the same as the condition on the electrical characteristics table, i.e., 0.01f, choose the capaci tance value in ratio referring to the above equation. timing chart reset on power on reset 13.5v 4.0v 4.0v 4.60v ct pull up voltage reset on reset on vcc power on reset 4.50v vhs 100mv 3v 0v 5v 0v 1.25v 1.15v 0.15v 0v 0v 0v out voltage vout ct clk reset
technical note 8/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. wdt timer on/off switch inh (resistance value is typical value) BD3021HFP-M has a switch inh to turn the wdt on/off ic internal block diagram by using inh on, ct potential can be pulled up to internal voltage vref_r (invalid with power on reset)) timing chart ct clk reset ct pull up voltgge upper switching threshold voltage lower switching threshold voltage wdt on vcc vout 13.5v 0v 5v 0v 1.15v 0.15v 0v 0v 0v out voltage 1.25v 5v 0v 5v inh low wdt on wdt off high inh ct 500k vref_r (typ P 1.25v) 10k on/off circuit external capacitor
technical note 9/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. timing chart 4.0v watch time 4.60v 4.50v vhs100mv wdt off(inh=on) 4.0v clk width<500ns wdt reset time reset on minimum reset movement voltage reset on power on reset power on reset ct clk reset vcc vout 13.5v 0v 5v 0v 1.15v 0.15v 0v 0v 0v out voltage 1.25v 5v 0v inh 3v 5v 5.5v reset on
technical note 10/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. thermal design fig.14 fig.15 refer to fig.14 and fig.15 thermal dissipation characteristics for usage above ta=25 . the ic?s characteristics are affected heavily by the temperature, and if is ex ceeds its max junction temperature (tjmax ), the chip may degrade or destruct. thermal design is critical in terms of avoiding instantaneous destruction and reliability in long term usage. the ic needs to be operated below its max junction temperature (tjmax) to av oid thermal destruction. refer to fig.14 and fig.15 for hrp7 package thermal dissipation characteristi cs. operate the ic within power dissipation (pd) when using this ic. power consumption pc(w) calculation will be as below (for fig.15 ) if load current io is calculated to operate within power dissipa tion, it will be as below, where you can find the max load curr ent io max for the applied voltage vcc of the thermal design. io Q pd vccicc2 vccvout (refer to fig2 for icc2) example) at ta=125 ,vcc=12v,vout=5v io Q 1.4612 icc2 125 io Q 208ma (icc2=150a) refer to above and adjust the thermal design so it will be within power dissipation within t he entire operation temperature range. below is the power consumption pc calculation when (vout-gnd short) pc=vcc(icc2+ishort) (refer to fig.4 for i short) 0 2 4 6 8 10 0 25 50 75 100 125 150 ambient temperature:ta[ ] power dissipaton:pd [ w ] 0 2 4 6 8 10 0 25 50 75 100 125 150 ambient temperature:ta[ ] power dissipaton:pd [ w ] 1.60w 7.3w 5.5w 2.3w mounted on a rohm standard board board size : 70 L 70 L 1.6 L (board contains a thermal) 2-layer board (back surface copper foil area :15 L 15 L) 2-layer board (back surface copper foil area :70 L 70 L) 4-layer board (back surface copper foil area :70 L 70 L) ? ja=54.3( /w) ? ja=22.7( /w) ? ja=17.1( /w) mounted on a rohm standard board board size : 70 L 70 L 1.6 L ja=78.1( /w) fig.15 : ja=17.1 /w -58.4mw/ 25 =7.3w 125 =1.46w pc=(vcc vout) io+vcc icc2 power dissipation pd R pc ishort: short current vcc vout io icc2 : input voltage : output voltage : load current : circuit current
technical note 11/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. pin settings / precautions 1. vcc pin insert a 0.33 ~ 1000f capacitor between the vcc and g nd pins. the appropriate capacitance value varies by application. be sure to allow a sufficient margin for input voltage levels. 2. output pins it is necessary to place capacitors between each output pi n and gnd to prevent oscillat ion on the output. usable capacitance values range from 0.1f ~ 1000f. abrupt fluctuations in input voltage and load conditions may affect the output voltage. output capacit ance values should be determined only through su fficient testing of the actual application. 3. ct pin connecting a capacitance of 0.01f ~ 1f on the ct pin is recommended. esr vs io(reference data) pin settings / precautions 2 measurement circuit vcc=5.6v 36v ta =-4 0 +125 io=0a 500ma cin=0.33f 100f cout=0.1f 100f 0.001 0.01 0.1 1 10 100 0 100 200 300 400 500 cout_io( ma) cout_esr( ) unstable operating region stable operating region vcc vo gnd cin esr io(rout) vcc (5.6~36v) (0.33 f ) cout(0.1 f ) (0.001 ? )
technical note 12/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. notes for use 1. absolute maximum ratings use of the ic in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the ic. assumptions should not be made regarding the state of the ic (e.g., short mode or open mode) when such damage is suffered. if operational values are expec ted to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. 2. electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits and other conditions. therefore, be sure to check a ll relevant factors, includin g transient characteristics. 3. gnd potential the potential of the gnd pin must be the minimum potential in the system in all operating conditions. ensure that no pins are at a voltage below the gnd at any time , regardless of transient characteristics. 4. ground wiring pattern when using both small-signal and large- current gnd traces, the two ground trac es should be routed separately but connected to a single ground potential within the application in order to avoid variat ions in the small-signal ground caused by large currents. also ensure that t he gnd traces of external components do not cause variations on gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. inter-pin shorts and mounting errors use caution when orienting and positioning the ic for mounting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pins and the power supply or gnd pins (caused by poor soldering or foreign objects) may result in damage to the ic. 6. operation in strong electromagnetic fields using this product in strong electromagnetic fields may cause ic malfunction. caut ion should be exercised in applications where strong electromagnetic fields may be present. 7. testing on application boards when testing the ic on an application board, connecting a capaci tor directly to a low-impedance pin may subject the ic to stress. always discharge capacitors completely after each pr ocess or step. the ic?s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the ev aluation process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 8. thermal consideration use a thermal design that allows for a sufficient margin in light of the pd in act ual operating conditions. consider pc that does not exceed pd in actual operating conditions. (pd R pc) tjmax : maximum junction temperature=150 , ta : peripheral temperature[ ] , ja : thermal resistance of package-ambience[ /w], pd : package power dissipation [w], pc : power dissipation [w], vcc : input voltage, vout : output voltage, io : load, icc2 : bias current2 package power dissipation : pd (w)=(tjmax ta ) / ja power dissipation : pc (w)=(vcc vout) io+vcc icc2 9. over current protection circuit (ocp) t he ic incorporates an integrated over-curre nt protection circuit that operates in accordance with the rated output capacity. this circuit serves to protect the ic from damage when the l oad becomes shorted. it is also designed to limit output current (without latching) in the event of a la rge and instantaneous current flow from a large capacitor or other component. these protection circuits are effective in preventing damage due to sudden and unexpecte d accidents. however, the ic should not be used in applications characteriz ed by the continuous or transitive ope ration of the protection circuits. 10. thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit, which is designed to turn the ic off completely in the event of thermal overload. it is not designed to pr otect the ic from damage or guarantee its operation. ics should not be used after this function has activated, or in applications wh ere the operation of this circuit is assumed. 11. applications or inspection processes where the potential of the vcc pin or other pins may be reversed from their normal state may cause damage to the ic's internal circuitry or el ements. use an output pin capacitance of 1000f or lower in case vcc is shorted with the gnd pin while the external capacitor is charged. insert a diode in series with vcc to prevent reverse current flow, or insert bypass diodes between vcc and each pin.
technical note 13/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. 12. positive voltage surges on vcc pin a power zener diode should be inserted between vcc and gnd fo r protection against voltage surges of more than 50v on the vcc pin. 13. negative voltage surges on vcc pin a schottky barrier diode should be inserted between vcc and gnd for protection against vo ltages lower than gnd on the vcc pin. 14. output protection diode loads with large inductance components may cause reverse current flow during startup or shutdown. in such cases, a protection diode should be inserted on the output to protect the ic. 15. regarding input pins of the ic this monolithic ic contains p+ isolation a nd p substrate layers between adjacent elem ents in order to keep them isolated. pn junctions are formed at the intersection of these p layers with the n layers of other elements, creating parasitic diodes and/or transistors. for example (refer to the figure below): when gnd > pin a and gnd > pin b, the pn junction operates as a parasitic diode when gnd > pin b, the pn junction o perates as a parasitic transistor parasitic diodes occur inevitably in the structure of the ic, a nd the operation of these parasiti c diodes can result in mutual interference among circuits, operational faults, or physical dam age. accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. example of simple monolithic ic architecture parasitic elements (pin a) parasitic elements or transistors (pin b) c b e n p n n p+ p+ parasitic elements or transistors p substrate (pin b) c b e transistor (npn) (pin a) n p n n p+ p+ resistor parasitic elements p gnd n gnd gnd vcc gnd vcc gnd
technical note 14/14 BD3021HFP-M www.rohm.com 2010.11 - rev. a ? 2010 rohm co., ltd. all rights reserved. ordering part number b d 3 0 2 1 h f p - m t r part no. part no. package hfp:hrp7 packaging and forming specification e2: embossed tape and reel direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs tr ( ) (unit : mm) hrp7 s 0.08 0.730.1 1.27 0.8875 1.9050.1 0.8350.2 1.5230.15 10.540.13 0.080.05 (max 9.745 include burr) 9.3950.125 s 1.0170.2 8.00.13 0.27 +0.1 - 0.05 4.5 + 5.5 ? 4.5 8.820.1 (6.5) 765432 1 (7.49)
r1010 a www.rohm.com ? 2010 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redunda ncy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospac e machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.

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